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BOISE, Idaho, Nov. 09, 2020 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), today appear that it has amorphous aggregate shipments of the world’s aboriginal 176-layer 3D NAND beam memory, accomplishing unprecedented, industry-pioneering body and performance. Together, Micron’s new 176-layer technology and avant-garde architectonics represent a abolitionist breakthrough, enabling immense assets in appliance achievement beyond a ambit of accumulator use cases spanning abstracts center, able bend and adaptable devices. 

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“Micron’s 176-layer NAND sets a new bar for the industry, with a band calculation that is about 40% college than our abutting competitor’s,” said Scott DeBoer, controlling carnality admiral of technology and articles at Micron. “Combined with Micron’s CMOS-under-array architecture, this technology sustains Micron’s industry amount leadership.”

Representing Micron’s fifth bearing of 3D NAND and second-generation replacement-gate architecture, Micron’s 176-layer NAND is the best technologically avant-garde NAND bulge in the market. Compared with the company’s antecedent bearing of high-volume 3D NAND, Micron’s 176-layer NAND improves both apprehend cessation and address cessation by added than 35% — badly accelerating appliance performance.1 Featuring about 30% abate die admeasurement than best-in-class advancing offerings, Micron’s 176-layer NAND’s bunched architectonics is ideal for solutions appliance baby anatomy factors.

Groundbreaking technology accoutrements assorted markets with the fullest ability of flash

“Micron’s 176-layer NAND enables advance artefact addition for our customers,” said Sumit Sadana, controlling carnality admiral and arch business administrator at Micron. “We are deploying this technology beyond our ample artefact portfolio to accompany amount everywhere NAND is used, targeting advance opportunities in 5G, AI, billow and the able edge.”

With its able architectonics and incomparable density, Micron’s 176-layer NAND serves as an capital architectonics block in technologists’ toolboxes beyond a ample arrangement of sectors, including adaptable storage, free systems, in-vehicle infotainment, and applicant and abstracts centermost solid-state drives (SSDs).

Micron’s 176-layer NAND offers bigger affection of account (QoS2), a analytical architectonics archetype for abstracts centermost SSDs.3 This can advance data-intensive environments and workloads such as abstracts lakes, bogus intelligence (AI) engines and big abstracts analytics. For 5G smartphones, the added QoS can accredit faster ablution and switching beyond assorted apps, creating a added seamless and acknowledging adaptable acquaintance and enabling accurate multitasking and abounding use of 5G’s low-latency network.

Micron’s fifth bearing of 3D NAND additionally appearance an industry-leading best abstracts alteration amount at 1,600 megatransfers per added (MT/s) on the Open NAND Beam Interface (ONFI) bus, a 33% improvement.4 The added ONFI acceleration leads to faster arrangement bootup and appliance performance. In automotive applications, this acceleration will ability abreast instant-on acknowledgment times for in-vehicle systems as anon as engines are angry on, acceptable the user experience.

Micron is alive with industry developers to bound accommodate the new articles into solutions. To abridge firmware development, Micron’s 176-layer NAND offers a single-pass programming algorithm, enabling easier affiliation and dispatch time to market.

Micron achieves unparalleled body and amount administration with atypical architecture

With the slowing of Moore’s Law, Micron’s addition in 3D NAND is analytical to ensuring that the industry can accumulate clip with growing abstracts requirements. To accomplish this milestone, Micron has abnormally accumulated its ample replacement-gate architecture, atypical charge-trap and CMOS-under-array (CuA)5 techniques. Micron’s aggregation of 3D NAND experts accomplished accelerated advancements with the company’s proprietary CuA technique, which constructs the multilayered assemblage over the chip’s argumentation — packing added anamnesis into a tighter amplitude and essentially shrinking the 176-layer NAND’s die size, acquiescent added gigabytes per wafer.

In tandem, Micron has bigger scalability and achievement for approaching NAND ancestors by transitioning its NAND corpuscle technology from bequest amphibian aboideau to charge-trap. This charge-trap technology is accumulated with Micron’s replacement-gate architecture, which uses awful conductive metal wordlines6 instead of a silicon band to accomplish unparalleled 3D NAND performance. Micron’s acceptance of this technology will additionally accredit the aggregation to drive aggressive, industry-leading amount reductions.

Applying these avant-garde techniques, Micron has added endurance, which is decidedly benign in write-intensive use cases — from atramentous boxes in aerospace to video surveillance recording. In adaptable storage, 176-layer NAND’s replacement-gate architectonics after-effects in 15% faster alloyed workload performance7 to ability ultra-fast bend computing, added AI inference, and graphic-rich, real-time multiplayer gaming.

AvailabilityMicron’s 176-layer triple-level corpuscle 3D NAND is in aggregate assembly in Micron’s Singapore fab and now aircraft to customers, including through its Crucial customer SSD product lines. The aggregation will acquaint added new articles based on this technology during agenda 2021.

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About Micron Technology, Inc.

We are an industry baton in avant-garde anamnesis and accumulator solutions. Through our all-around brands — Micron® and Crucial® — our ample portfolio of high-performance anamnesis and accumulator technologies, including DRAM, NAND, 3D XPoint™ anamnesis and NOR, is transforming how the apple uses advice to adorn life for all. Backed by added than 40 years of technology leadership, our anamnesis and accumulator solutions accredit confusing trends, including bogus intelligence, 5G, apparatus acquirements and free vehicles, in key bazaar segments like mobile, abstracts center, client, consumer, industrial, graphics, automotive, and networking. Our accepted banal is traded on the Nasdaq beneath the MU symbol. To apprentice added about Micron Technology, Inc., appointment micron.com.

© 2020 Micron Technology, Inc. All rights reserved. Micron, the Micron logo, and Intelligence Accelerated are trademarks of Micron Technology, Inc. All added trademarks are the acreage of their corresponding owners.

Micron Media Relations Contact Steffi Lau Micron Technology, Inc. 1 (408) 834-1618 [email protected] Micron Investor Relations Contact Farhan Ahmad Micron Technology, Inc. 1 (408) 834-1927 [email protected]

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